Post Dry etch residue removal
Our advanced formulations are engineered to tackle one of semiconductor manufacturing’s toughest challenges:
Complete and selective removal of post-dry etch residues and polymers without compromising delicate device structures.
By combining powerful cleaning efficiency with precise material selectivity, our solutions help fabs:
·Enhance Yield and Device Integrity: Eliminate stubborn residues that can cause defects, leakage paths, or reliability issues.
·Support Advanced Nodes: Designed to meet the strict cleanliness requirements of today’s and tomorrow’s most advanced semiconductor devices.
With our tailored residue removal solutions, we empower fabs to achieve higher performance, improved reliability, and faster time-to-market—all while maintaining the highest standards of process integrity