Pattern collapse Solutions

As semiconductor devices scale to ever-smaller nodes, high aspect ratio features such as fins and trenches become increasingly prone to pattern and fin collapse, threatening yield, reliability, and performance. Our company develops custom chemical strategies and formulations specifically engineered to address these challenges.

By leveraging our deep expertise in specialty chemistry, we help semiconductor fabs:

·Prevent Feature Collapse: Tailored formulations stabilize delicate structures during wet processing, preserving critical dimensions and integrity. 

·Enhance Yield and Reliability: Reduce defects caused by mechanical or capillary-induced collapse, improving device performance.

·Integrate Seamlessly: Solutions designed to fit into existing process flows with minimal disruption and maximum reproducibility.

·Accelerate Innovation: Collaborative development allows fabs to optimize chemistry for next-generation architectures, including extreme aspect ratio fins and advanced 3D structures.

•Promote Safety and Sustainability: Formulations are designed with environmental responsibility and fab safety in mind