Post CMP Cleaners

M-R Advanced Technologies post CMP cleaner formulations are engineered to deliver unmatched post-polish performance—removing particles, metal residues, and organic contaminants with exceptional precision while protecting delicate device structures. Designed for current and advanced semiconductor nodes and compatible with Cu, W, Co and dielectric materials. 

Attractive cost of ownership – We develop concentrated cleaners as well to provide lower cost at point-of-use. 

Our innovative solutions ensure superior surface cleanliness, improved yield, and seamless integration into your CMP processes—all with a focus on safety, consistency, and environmental responsibility.