M-R Advanced Technologies designs and manufactures customer specified formulations.
Selective Wet Etch and Clean Formulations
- Titanium (Ti) and Titanium Nitride with compatibility towards Tungsten (W), Silicon dioxide (SiO2), Copper (Cu), and dielectric materials
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Silicon (Si), Silicon, Germanium (SiGe), Germanium (Ge)
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Platinum (Pt) alloys
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Cobalt (Co)
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Aluminum (Al)
Technologies for
- Pattern collapse prevention
- Corrosion prevention of Cu, W, Al, Co, etc..
- Photo Resist Stripping.
- Removal of Sacrificial organic and inorganic films.
Custom Nanomaterial Synthesis
- Si, Tin Oxide (SnO2) doped/undoped Nanoparticles and Nanowires
- Copper Nanowires